- FAW Group to establish flying car headquarters in Shenzhen's Dapeng New Area
This agreement officially marks the establishment of FAW Group's flying car headquarters project in Dapeng New Area, Shenzhen city.
June 16 , 2025
- FAW Group, Tsinghua Unigroup forge strategic partnership to build automotive-grade chip ecosystem
On May 16, FAW Group and Tsinghua Unigroup signed a strategic cooperation agreement in Beijing, aiming to deepen collaboration across multiple areas of China's automotive semiconductor industry.
May 16 , 2025
- Hongqi launches new models in UAE, Bahrain
FAW Group's passenger vehicle brand Hongqi recently launched its H9, HS7, and H6 vehicle models in the United Arab Emirates (UAE), Bahrain, and other Gulf nations, the automaker announced on March 25 ...
Mar. 26 , 2025
- FAW Audi, Zhongsheng Group sign MoU to expand dealership network
On March 11, FAW Audi Sales Co., Ltd. (FAW Audi）and Zhongsheng Group Holdings Limited signed a strategic cooperation agreement in Hangzhou.
Mar. 12 , 2025
- FAW Group, Leapmotor sign strategic cooperation MoU to strengthen NEV development
On March 3, 2025, China's FAW Group and Leapmotor signed a Memorandum of Understanding (MoU) on Strategic Cooperation in Changchun city.
Mar. 03 , 2025
- Hongqi Tiangong 05 all-electric sedan hits market, starting at 159,800 yuan
On February 26, FAW Group's premium passenger vehicle brand Hongqi officially put the Tiangong 05, all-electric midsize sedan onto the market. The model is available in four variants, with a price ran...
Feb. 26 , 2025
- FAW Bestune launches new vehicle platform, power system, smart cockpit
On February 25, FAW Group's passenger vehicle brand Bestune held its tech day event, officially debuting its core technologies including the Yueying Platform, Zhuri Power System, and Ruyi Cockpit.
Feb. 26 , 2025
- SiEngine, FAW Group set up joint lab for onboard chip applications
Chinese automotive chip developer SiEngine Technology and FAW Group have inked a domain-fusion chip collaboration agreement and jointly inaugurated the Collaborative Innovation Lab for Onboard Chip Ap...
Feb. 24 , 2025
